PCB Layout Engineer, Robotics

OpenAI · San Francisco · $318K – $485K · Engineering

Posted 2026-09-02

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About the Team

Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives.

About the Role

We are looking for a PCB Layout Engineer to design high-density electronics for next-generation robotic systems. You will own PCB layout from floor planning through fabrication release, working closely with electrical, SI/PI, mechanical, and manufacturing teams.

This role is based in San Francisco and requires in-person presence four days per week.

In this role, you will:

- Own PCB layout, component placement, routing, and fabrication release for complex robotic systems.

- Collaborate with SI/PI engineers to refine layouts based on simulation results.

- Implement high-speed routing, controlled impedance, power distribution, decoupling, grounding, EMI/EMC, thermal, and mechanical-integration requirements.

- Work directly with fabricators and assembly partners to define stack-ups, establish design rules, drive DFM/DFA/DFT reviews, and close findings before release.

- Prepare fabrication and assembly documentation, including drawings, ODB++, drill files, stack-up tables, and manufacturing notes.

- Inspect newly received PCBAs and participate in board-level manufacturing failure analysis.

- Contribute to reusable design constraints and layout workflows, and maintain component-library assets such as symbols, footprints, and 3D models.

You might thrive in this role if you:

- Have 6+ years of experience designing complex, multilayer PCBs.

- Are fluent in Cadence Allegro PCB Designer and Constraint Manager.

- Have strong HDI design experience, including fine-pitch BGAs, microvias, blind and buried vias, via-in-pad, and sequential lamination.

- Understand signal and power integrity fundamentals, including return paths, differential pairs, length matching, crosstalk, and power delivery.

- Have experience working with PCB fabricators on stack-up development, manufacturing constraints, and DFM.

- Communicate effectively across engineering disciplines and with external manufacturing partners.

Preferred qualifications:

- Experience with rigid-flex boards or other mechanically constrained designs.

- Experience routing PCIe, DDR, USB, Ethernet, MIPI, or similar high-speed interfaces.

- Familiarity with SI/PI simulation tools such as Cadence Sigrity or Ansys SIwave.

- Experience laying out power supplies or other power-electronics circuits or mixed-signal systems.

- Familiarity with IPC standards, Cadence SKILL scripting, or layout automation.

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